JPH073556Y2 - 温度ヒューズ - Google Patents
温度ヒューズInfo
- Publication number
- JPH073556Y2 JPH073556Y2 JP2048488U JP2048488U JPH073556Y2 JP H073556 Y2 JPH073556 Y2 JP H073556Y2 JP 2048488 U JP2048488 U JP 2048488U JP 2048488 U JP2048488 U JP 2048488U JP H073556 Y2 JPH073556 Y2 JP H073556Y2
- Authority
- JP
- Japan
- Prior art keywords
- sealing resin
- thermal fuse
- metal body
- lead wire
- enclosure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 22
- 239000011347 resin Substances 0.000 claims description 22
- 238000007789 sealing Methods 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 17
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 238000011282 treatment Methods 0.000 claims description 9
- 238000002844 melting Methods 0.000 description 15
- 230000008018 melting Effects 0.000 description 12
- 239000000758 substrate Substances 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 5
- 230000004907 flux Effects 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 239000011247 coating layer Substances 0.000 description 4
- 238000007598 dipping method Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000006223 plastic coating Substances 0.000 description 1
Landscapes
- Fuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2048488U JPH073556Y2 (ja) | 1988-02-17 | 1988-02-17 | 温度ヒューズ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2048488U JPH073556Y2 (ja) | 1988-02-17 | 1988-02-17 | 温度ヒューズ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01124638U JPH01124638U (en]) | 1989-08-24 |
| JPH073556Y2 true JPH073556Y2 (ja) | 1995-01-30 |
Family
ID=31236892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2048488U Expired - Lifetime JPH073556Y2 (ja) | 1988-02-17 | 1988-02-17 | 温度ヒューズ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH073556Y2 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2571046Y2 (ja) * | 1989-08-29 | 1998-05-13 | 内橋エステック 株式会社 | 温度ヒューズ |
-
1988
- 1988-02-17 JP JP2048488U patent/JPH073556Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01124638U (en]) | 1989-08-24 |
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